Carsem provides turnkey packaging and test services to the semiconductor industry. We are a member of the Hong Leong Group in Malaysia.
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turnkey test services for rf, mixed-signal, analog, digital, power, devices, semiconductor testing, system in package, micro leadframe package, fcol, flip chip on leadframe, semiconductors factory, malaysia, flipchip technology, hong leong group bhd, mpi, malaysian pacific industries berhad