Pactech.de
- Title
- PacTech - Packaging Technologies - Home
- Meta Description
- The official website of PacTech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
- Meta Keywords
- wafer level packaging, advanced packaging equipment, WLCSP, wafer bumping, wafer level, backend, semiconductor, packaging, equipment, solder balls, pac tech, ubm, UBM, eless, NiAu, NiPdAu, solder jetting, ball drop, rework, ENIG, ENEPIG, opm, OPM, solder balling, microelectronics, flip chip, tape and reel, backgrinding, backmetal, RDL, redistribution, dicing, sawing, wafer level processing, electronics packaging, backend processing, BEOL, semiconductor processing, WLP, under bump metallization, solder bumping, solder, wafer thinning, backside metallization, backside laser marking, wafer dicing, die sort, test and inspection, assembly
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